QEX

Figure 6—Schematic of the LO circuit board.

C3—20 pF miniature air-dielectric variable.

C4, C5—Sprague GYA trimmers. D3, D4—Schottky diode, HP5082-2835 or equiv.

L8, L9—8 turns #26 wire on '/< inch plastic rod.

L10, L11—9 turns #26 wire on 1/4 inch plastic rod, with a 1 turn tap.

L12—10 turns #24 tinned wire formed on a #10-32 machine screw.

L13, L16—1 turn #24 tinned wire formed on a #10-32 machine screw.

L14, L15—5 turns #24 tinned wire formed on a #10-32 machine screw. L17, L18—6 turns #24 tinned wire formed on a #10-32 machine screw. LI 9, L20—See Fig 3 (FL5).

Figure 7—Layout of the SBM circuit board. (1) The 0.062x0.100 inch glued down stripline foil is filed clear about Vie inch to permit decoupling isolation. Strlplines are cemented to the mounting base with Duco Cement. (2) Ground return for the MMIC amplifiers. They are V\0£tm% inch tinned brass pads soldered to the mounting base. All parts shown in the Fig 2 schematic that are not indicated in this layout are mounted on the reverse side. This is primarily parts concerned with the post-amplifier.

Figure 7—Layout of the SBM circuit board. (1) The 0.062x0.100 inch glued down stripline foil is filed clear about Vie inch to permit decoupling isolation. Strlplines are cemented to the mounting base with Duco Cement. (2) Ground return for the MMIC amplifiers. They are V\0£tm% inch tinned brass pads soldered to the mounting base. All parts shown in the Fig 2 schematic that are not indicated in this layout are mounted on the reverse side. This is primarily parts concerned with the post-amplifier.

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